Coating galaw shapraw ai line ni gaw, substrate ntsa hpe gram lajang na matu, physical (sh) chemical ladat ni hpe jai lang nna, n-gun ja ai hku galaw shapraw na matu, madung arung arai ni rai nga ai. Dai ni hpe electronics, mawdaw, optics, n-gun nnan ni hta jai lang ma ai.
1. Semiconductor dingyang matut manoi magnetron n-gun rawng ai shingnip shingna galaw shapraw ai ladat
Features: Hkum tsup ai hku shi hkrai shi galaw lu ai, tsan tsan kaw nna yu reng ai hpe madi shadaw ya ai; grau kaja hkra galaw shapraw lu na matu, bungli galaw ai arung arai rack hpe shi hkrai shi jaw sha ai; target structure design gaw jai lang ai lam hpe jat ya nna, grau bung ai sputtering hpe byin shangun ai; substrate ionization ladat gaw grau n-gun ja ai sumla hkrung hpe n-gun jaw ya ai.
Ladat: Nhtoi n-gun rawng ai cell, hydrogen wan sau cell bipolar plate, ITO n-gun rawng ai shingnip, mawdaw madun ai jak ni, ceramic circuit board ni hta lang ai.
2. Hka htung n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai magnetron n-gun rawng ai n-gun rawng ai shingnip shingna galaw shapraw ai lam
Laksan hku nna: Industrial computer hte hkum tsup ai hku hkang lu ai; automatic bungli galaw ai rack htaw sa ai; hka htung-to-hka htung hpe shinggrup na matu kaja dik htum yaw shada ai hkrang; sputtering langai sha re ai lam tsaw ai; substrate ionization galaw ai ladat gaw sumla hkrung a hkam kaja lam hpe grau kaja hkra galaw ya ai.
Hpa majaw nga yang, npu kaw jung da ai capacitor ni hte n-gun n rawng ai -film resistor ni hta lang ai.
3. DPC n-gup magap matut manoi Magnetron n-gup magap galaw shapraw ai ladat
Features: Hkum tsup ai hku galaw shapraw ai; Hkying hkum mi hta 288 lang; lahkawng lang - maga de shinggrup da ai gaw langai sha re ai hpe madi shadaw ya ai; n-gun ja ai magnetic field hpe n-gun ja shangun ai; conductivity hte katsi ai hpe shapraw kau lu ai atsam hpe grau kaja hkra galaw ya ai.
Ladat: Semiconductor jak ni rai nga ai, nlung npan, nlung npan capacitor, LED nlung npan bracket ni hta lang ai.
